Die Bonding
The Die Bonding is the first and most important procedure for packaging MEMS sensor. CFSensor own six AD830 machines and two bonding engineers.
Wire Bonding
The Wire Bonding is the second and very important procedure for packaging MEMS sensor. CFSensor own 18 piece KS machines and two bonding engineers.
Dispensing
Dispensing is gluing for back cover after wire bonding.
Heating
The glue need be solidified after Die bonding and Dispensing
Marking
Marking the data/batch etc, information on back of sensor